建議您使用以下瀏覽器觀看本網站，
以獲得最佳瀏覽效果。
Chiform provides services to major semiconductor packaging companies (OSAT), offering precision parts, carriers, jigs, tooling and more for both front-end and back-end processes. We are dedicated to precision machining of tungsten carbide and hardened steel, producing stable and precise machining quality at the micron level (μm), to meet customers' precise requirements for their parts. We look forward to collaborating with our customers and suppliers to pursue growth together.
Application areas
We strive to meet our customers' custom product needs by providing the best advice on materials, design, machinery, and manufacturing processes. With over forty years of experience in semiconductor packaging tools, we deliver top-quality products with our professional team."
